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Product Name

A7 A8 A9 CPU Flash Tool BGA Reball Stencils Planted Tin Mold

  • History: 0 Orders
  • Model: PRK031
  • Shipping Weight: 0.2kg
  • Units in Stock: 1000
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   $59.99

Please Choose:

  • Option1
  • Option2
  • Option3

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A7 A8 A9 CPU Mold come with upper and Lower. BGA Tin Mould For ipone 6 6P 6S 6SP is easy to use. BGA Reball Stencils For A7 A8 A9 CPU.


A7 A8 A9 CPU Flash Tool BGA Reball Stencils Planted Tin Mold

Option1: A7 Upper+ A7 Lower BGA Reballing Stencil

Option2: A8 Upper+ A8 Lower BGA Reball Tool dedicate for iphone 6 6P 6S 6SP

Option3: A9 Upper+ A9 Lower Planted tin mold

A7 A8 A9 CPU Mold

BGA Tin Mould For ipone 6 6P 6S 6SP

Characteristic:

Aerospace technology manufacturing
Open hole position precision
Square opening tin pulp is easy to fall off
Hole wall smooth without residue
Remove the IC solder ball can effectively release completely
Reduce the repair rate to improve the quality of welding

Package List

1Set Planted Tin Mold
 

 

 

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