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Product Name

A8 A9 A10 3D Tin Plant groove BGA Reballing Stencil CPU HDD WIFI IC

  • History: 0 Orders
  • Model: PRK058
  • Shipping Weight: 0.22kg
  • Units in Stock: 1000
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   $88.00

Please Choose:

  • Option1
  • Option2
  • Option3
  • Option4

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MJ A8 A9 A10 3D Tin Plant Net For iphone 6 6S 6p 6sp 7 7p A8 A9 A10. 3D BGA Reballing Stencil template Fixed CPU CHIP IC baseband Power and Wifi. groove(automatic counterpoint) Tin mesh is a full set.


Groove 3D BGA Reballing Stencil template For Iphone A8 A9 A10

Option1: 1PC MJ 3D A8 + 1PC MJ 3D A9 + 1PC MJ 3D A10

Option2: 3PC MJ 3D A8

Option3: 3PC MJ 3D A9

Option4: 3PC MJ 3D A10

Thickness: 0.25mm

3D molding, thickening and hardening

3D stell Net unique groove Fixed IC, quick Positioning



MJ 3D A8 BGA Reballing Stencil: including iphone6/6 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A8 upper and lower CPU

MJ 3D A9 BGA Reballing Stencil: including iphone6s/6s plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A9 upper and lower CPU

MJ 3D A1o BGA Reballing Stencil: including iphone7/7 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A10 upper and lower CPU



Package List:

1 X MJ 3D A8 Tin Plant
1 X MJ 3D A9 Tin Plant
1 X MJ 3D A10 Tin Plant

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