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eMMC eMCP Reballing Stencil eMCP221 eMMC153 eMCP162 eMCP186 Solder Ball Mounting

  • History: 1 Orders
  • Model: CTS078
  • Shipping Weight: 0.26kg
  • Units in Stock: 999
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   Starting at: $79.00

Please Choose:

  • Option1
  • Option2 ( +$10.99 )

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eMMC/eMCP Reballing Tool NAND chip Reballing stencil. eMCP221 eMMC153 eMCP162 eMCP186 Solder Ball Mounting capable apply to eMMC153/169, eMCP162/186 IC reballing at the same time. BGA Reballin Template stecil for eMMC/eMCP.


eMMC eMCP Reballing Stencil eMCP221 eMMC153 eMCP162 eMCP186 Solder Ball Mounting

Option1: eMCP221 eMMC153 eMCP162 3-in-1 reballing Jig 

Option2: eMCP221 eMMC153 eMCP162 eMCP186 4-in-1 reballing Tool

Do not heat the stencil, this one is not for heating reball, it is an easy way to reball without heat!

Usage:

1) put the tin solder paste through the stencil 1 T=0.12
2) remove the stencil 1 T=0.12
3) pour balls through stencil 2 T=0.15
4) remove the stencil 2 T=0.15
5) Weld the chip into your device

Package List:

eMCP221 reballing position X1
eMMC153 reballing position X1
eMCP162 reballing position X1
eMCP186 reballing position X1

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