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eMMC eMMC169 eMMC153 Socket with USB For BGA169 BGA153 Testing

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  • Model: CTS002
  • Shipping Weight: 0.3kg
  • Units in Stock: 1000
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   $98.00  $89.009% off

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eMMC eMMC169 eMMC153 Socket with USB compatible with 153-FBGA 169-FBGA. For BGA169 BGA153 Testing eMMC pitch 0.5mm 30pin. eMMC169 eMMC153 Test Socket Adapter to USB Interface output.


eMMC eMMC169 eMMC153 Socket with USB For BGA169 BGA153 Testing

eMMC socket with USBfor BGA 169 and BGA 153 Nand flash testing, Support Clamshell solder ball testing

UBGA169 BGA153 Testing sage:

Programming Block, Test Block, for EMMC153 / 169 IC chip testing, read and write

eMMC169 eMMC153 Socket with USB Test Methods:

1. Select and IC matching the bounding box, placed parallel to the direction of the IC SOCKET press within
2. USB cable into your computer USB port, turn on the power switch on the nest, select the appropriate test procedures

Applicable Package: EMMC169 / 153 pin 0.5mm pitch

Test Block: EMMC153 / 169 0.5

eMMC169 eMMC153 Socket with USB Specifications:

1. This eMMC socket is for BGA 169 and BGA 153 testing.
2. The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.
3. Support hot swap and a separate power supply switch.
4. Apply to eMMC of for Samsung, for Sandisk, for Toshiba, for Hynix, for Micron, HTC, MTK and Intel.
5. eMMC data could be read and written fastly.
6. With 30 pins and pin pictch 0.5mm.
7. eMMC size of this product is 12x18mm, we also provide other sizes of

                            
                             11.5x13mm
                             14x18mm
                             12x16mm
 
8. Apply to eMMC thickness of 0.8mm and 1.5mm.
9. Just insert the USB into your PC, it is easy use.
10. Accurate positioning on flat bottom pad and solder of eMMC.
11. Life cycle is around 25,000 times.
12. Support flat bottom and solder ball testing (with or without ball).

 

 

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