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Wednesday 22 February, 2017 | RSS Feed

The Difference Of IC Grinding Machine and BGA Rework station?

by NandRepair.com


IC Polishing Grinding Machine with the advanced development of IC chips in electronic application, some main board needs better tools to get repaired, especially in iPhone smart phones repair which with under filled sophisticated chipsets.


But What is The Difference Of  IC Grinding Machine and BGA Rework station?

Actually, they are used in different steps in a motherboards repair.

If use a BGA rework station or desoldering station to repair a phone with special under filled ICs, below situation would happen:

1. BGA chip is difficult to be removed as solder ball melts but glue still not.
2. Uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chip’s solder point and cause short circuit.

But If use IC Polishing Grinding Machine

1. We can engraving the whole chip and show the PCB pads.
2. PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chip’s tilt angle.
3. Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
4. No need to do glue removing.






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