Press Esc key to close this popup
Product Name

WL BGA Reballing Reball Tin Steel Net Stencil For iphone Nand Baseband

  • History: 1 Orders
  • Model: PRK052
  • Shipping Weight: 0.1kg
  • Units in Stock: 999
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   Starting at: $29.99

Please Choose:

  • Option1
  • Option2
  • Option3
  • Option4
  • Option5 ( +$55.00 ) (+0.1kg)

1 Reviews            
  • Details
  • Order History
  • Reviews
  • Online Chat
  • Tags
  • Shipping&Payment

For Iphone Nand Baseband Chip BGA Reball Stencil with Fixed Plate and Holder. BGA Reballing Solder Template Stencil Support for iphone series Baseband ic Chip. WL Fast Speed BGA reballing Solder stencil come with Magnetic base + positioning plate +tin mesh.


WL BGA Reballing Reball Tin Steel Net Stencil For iphone Nand Baseband

0.1-0.12mm thickness, high hardness, hardly deformed,  increase the success rate on BGA reballing Solder working, it is the  top quality BGA Reballing Stencil for iphone 5/5s 6/6p 6s/6sp 7/7p Baseband CPU and NAND.

Option1: For Iphone 5/5S NAND BaseBand IC Chip

Option2: For Iphone 6/6P

Option3: For Iphone 6S/6SP

Option4: For Iphone 7/7P

Option5: Full Set (Option 1-4), only send 1PCS Universal Aluminum Mold Base (Golden)








Package include:

1 x Steel Net
1 x Positioning Mold(Black)
1 x Holder

Similar Products