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Product Name

WL BGA Reballing Stencil For iphone NAND CPU A8 A9 Processor

  • History: 1 Orders
  • Model: PRK053
  • Shipping Weight: 0.1kg
  • Units in Stock: 999
(Shipped from China . Complete orders today. Parcel arrived 3-7 working Days After Confirmed )

Price:   Starting at: $29.99

Please Choose:

  • Option1
  • Option10
  • Option11 ( +$169.00 ) (+0.15kg)
  • Option2
  • Option3
  • Option4
  • Option5
  • Option6
  • Option7
  • Option8
  • Option9

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BGA reball Tin Net Stencil is a great repairing platform for iphone. WL BGA Reballing Stencil For iphone NAND CPU A6/A7/A8/A9/A10. BGA reballing Solder template stencil is a full set(Magnetic base + positioning plate + tin mesh).


WL BGA Reballing Stencil For iphone NAND CPU A8 A9 Processor

Note: the upper and lower layers are all-in-one, means that the entire CPU is pulled down, not layered.

Option1: A6 CUP CPU Upper

Option2: A7 CUP CPU Upper

Option3: A6/A7 CPU Lower

Option4: A8 CPU Upper

Option5: A8 CPU Lower

Option6: A8 CPU upper and lower layers are all-in-one

Option7: A9 CPU Upper

Option8: A9 CPU Lower

Option9: A9 CPU upper and lower layers are all-in-one

Option10: A10 CPU Lower

Option11: Full Set (Option 1-10), only send 1PCS Universal Aluminum Mold Base (Golden) 






 

 

 

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